Thermal Paste CPU 1.8g with Toolkit for CPU GPU IC and Heatsinks
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Technical Specifications
Key Features
SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card.
BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.
HIGH DURABILITY: BSFF thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years.
EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners